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» Capabilities and
Processes: |
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Cleanroom: |
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Plasma Etch
Analytical
Optical Litho
E-Beam |
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Laboratories |
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Laser Lab Wet Chemistry AFM Chemical
Vapor Deposition (CVD) Material synthesis
Film Properties X-Ray Diffraction Pulse
Laser Moleculaor Beam Epitaxy (MBE) Scanning
Electron Microscope (SEM) Tissue Culture
Material Synthesis Bio Research
Measurement Lab |
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Growth Properties
Characterization Growth Properties VAC and
Prep Growth Properties Microscope Proximal
Probes Optical |
| Microscopy |
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Proximal Probes Instrument
Proximal Probes Wet chemistry
Electron Microscopy Sample Prep
UHV Prep
RF Shielded Room |
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» Environmental
Criteria: |
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Temperature:
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Cleanroom |
68°F ± 1°F,
50%RH ± 5% |
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Laboratories |
72°F ± 1°F,
30 ~ 50%RH ± 5% |
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Electron
Microscopy (4Rms) |
70°F ±
0.18°F, 50%RH ± 5% |
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Electron
Microscopy (1Rms) |
70°F ±
0.5°F, 30 ~ 50%RH ± 5% |
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Office |
74 ~ 70°F ±
2°F, 30 ~ 50%RH ± 5% |
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Support
Facilities |
74 ~ 70°F ±
2°F, 30 ~ 50%RH ± 5% |
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Vibration: |
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General
Labs |
2000 - 4000
µinch/s |
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Class 1000
Cleanrooms |
1000
µinch/s (VC-B) |
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Class 100
Cleanrooms |
250 µinch/s
(VC-D) |
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Class 10
Cleanrooms |
125 µinch/s
(VC-E) |
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Metrology;
Surface Characterization |
125-250
µinch/s (VC-D to VC-E) |
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Nanostructures AFM |
125 µinch/s
(VC-E or NIST-A) |
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Nanostructures Instrument Development |
<50
µinch/s (NIST-A1) |
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Noise: |
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General Lab |
NC 35 ~ NC
45 |
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Cleanroom |
NC55 ~ NC
65 |
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Metrology;
Surface Characterization |
NC 30
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Nanostructures AFM |
NC30 |
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Nanostructures Instrument Development |
NC30 |
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Cleanliness: |
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E-Beam |
Class 100 |
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Prep/Optical Lithography |
Class
100 |
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Analytical |
Class 1,000 |
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Plasma/Etching |
Class 1,000 |
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Thermal
Evap./Sputtering |
Class 1,000 |
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Clean
Corridor |
Class 1,000 |
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Gowning,
Vestibule |
Class
10,000 |
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Service
Galley |
Class
10,000 |
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Electro
Magnetic Interference |
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General
laboratories/Electrical Characterization |
1
milligause |
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Selected
Labs |
0.1
milligause |