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Speaker:
Mark
Jamison
HDR
Architecture, Inc.
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This presentation will discuss the
characteristics of a 300mm wafer fab for industry and how the
requirements of this facility type relate to other buildings
for advanced technology. Specific contamination issues are identified
and cleanroom solutions are outlined to address these issues.
The presentation also reviews how evolving semiconductor technology
has affected the design of the cleanroom environment and where
future technology will lead us.
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(461
KB) |
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Speaker:
Michael
Somin
Earl
Walls and Associates
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The discussion will be organized
around the theme of chemical contamination as it relates to
biological investigations in an Advanced Technology Facility.
We will investigate the challenges of combining BSL-3 or BSL-4
units within high tech cleanrooms. Can the positive pressure
and recirculated air requirements of cleanrooms work with the
negative pressure and exhausted air needs of biocontainment
facilities? We will explore the requirements and outline some
possibilities.
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(1.3
MB)
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Speaker:
John
Weaver
Delphi
Delco Electronics Systems
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Over the past eighteen years,
there has been a major change in cleanliness requirements for
semiconductor cleanrooms and a corresponding change in the design
of cleanrooms to meet those requirements. To achieve cleanliness
levels of ISO Class 3 (formerly Class 1 per Federal Standard
209E), a new cleanroom is generally designed and constructed.
In the case of the Roland Project at Delphi Delco Electronics
Systems, a portion of a 1985-vintage Class 10 (Fed. Std. 209E)
cleanroom was modified to achieve the more stringent requirements
of ISO Class 3. This case study discusses the design of the
facility modifications and the implementation of the construction
project that achieved the cleanliness goals for the cleanroom.
Included in the project were modifications to the air handling
system and terminal filters, upgrades to the utilities supplied
to the facility, modification of the bay-chase design of the
cleanroom, and the installation of an entirely new tool set.
All these were accomplished while maintaining production in
the adjacent Class 10 portion of the cleanroom, which was in
continuous operation. Also discussed are the clean-construction
protocols that were utilized during the project and the final
commissioning of the facility.
The project was completed successfully, meeting all of the cleanliness
goals without interruption of, or cleanliness impact on, the
adjacent production facility. The cleanroom modifications were
achieved on-time and on-budget, and all product-cleanliness
targets were exceeded.
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(1.3
MB) |
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Speaker:
Tim
Loughran
AdvanceTEC,
LLC
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One of the most serious and
common mistakes made in the design of cleanroom facilities is
starting design before all the requirements have been identified.
Properly executed programming and planning provide the most
reliable foundation for a successful cleanroom design and construction
project. Programming, a term utilized in the design community
to make information gathering look more attractive to team participants,
develops the body of information needed to identify, clarify,
and prioritize the cleanroom requirements. This program will
discuss the cause and effect of improper programming on the
design of a microelectronics facility.
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(112
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